Highly packaged terahertz down-converter modules using 3-D integration

Authors

F Rodriguez-Morales
KS Yngvesson
D Gu
J Nicholson
K Fu
C Chan

Publication Date

2007

Journal or Book Title

IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS

Pages

742-744

Volume

17

Issue

10

Recommended Citation

Rodriguez-Morales, F; Yngvesson, KS; Gu, D; Nicholson, J; Fu, K; and Chan, C, "Highly packaged terahertz down-converter modules using 3-D integration" (2007). IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS. 499.
Retrieved from https://scholarworks.umass.edu/cs_faculty_pubs/499