Modeling of interconnections and isolation within a multilayered ball grid array package
Publication Date
1999
Journal or Book Title
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES
DOI
https://doi.org/10.1109/22.788517
Pages
1819-1825
Volume
47
Issue
9
Recommended Citation
Ito, R; Jackson, RW; and Hongsmatip, T, "Modeling of interconnections and isolation within a multilayered ball grid array package" (1999). IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES. 665.
https://doi.org/10.1109/22.788517
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