Title

Core Test Wrapper Design to Reduce Test Application Time for Modular SoC Testing

Authors

H Yi
S Kundu

Publication Date

2008

Pages

412-420

Journal Title

23RD IEEE INTERNATIONAL SYMPOSIUM ON DEFECT AND FAULT-TOLERANCE IN VLSI SYSTEMS, PROCEEDINGS

Book Series Title

IEEE International Symposium on Defect and Fault-Tolerance in VLSI Systems



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