Core Test Wrapper Design to Reduce Test Application Time for Modular SoC Testing
Journal or Book Title
23RD IEEE INTERNATIONAL SYMPOSIUM ON DEFECT AND FAULT-TOLERANCE IN VLSI SYSTEMS, PROCEEDINGS
Book Series Title
IEEE International Symposium on Defect and Fault-Tolerance in VLSI Systems
Yi, H and Kundu, S, "Core Test Wrapper Design to Reduce Test Application Time for Modular SoC Testing" (2008). Electrical and Computer Engineering Faculty Publication Series. 904.
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