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ORCID

N/A

Access Type

Open Access Thesis

Document Type

thesis

Degree Program

Electrical & Computer Engineering

Degree Type

Master of Science in Electrical and Computer Engineering (M.S.E.C.E.)

Year Degree Awarded

2016

Month Degree Awarded

February

Abstract

With the advent of technology scaling lifetime reliability is an emerging threat in high-performance and deadline-critical systems. High on-chip thermal gradients accelerates localised thermal elevations (hotspots) which increases the aging rate of the semiconductor devices. As a result, reliable operation of the processors has become a challenging task. Therefore, cost effective schemes for estimating temperature and reliability are crucial. In this work we present a reliability estimation scheme that is based on a light-weight temperature estimation technique that monitors hardware events. Unlike previously pro- posed hardware counter-based approaches, our approach involves a linear-temporal-feedback estimator, taking into account the effects of thermal inertia. The proposed approach shows an average absolute error of

We then present a counter-based technique to estimate the thermal accelerated aging factor (TAAF), which is an indicator of lifetime reliability. Results demonstrate that the estimation error is within [−3, +5].

DOI

https://doi.org/10.7275/7965036

First Advisor

Israel Koren

Second Advisor

C.M. Krishna

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