Analysis of electromigration-induced void motion and surface oscillations in metallic thin-film interconnects
Publication Date
2005
Journal or Book Title
Materials, Technology and Reliability of Advanced Interconnects-2005
Pages
277-282
Volume
863
Book Series Title
MATERIALS RESEARCH SOCIETY SYMPOSIUM PROCEEDINGS
Recommended Citation
Cho, J; Gungor, MR; and Maroudas, D, "Analysis of electromigration-induced void motion and surface oscillations in metallic thin-film interconnects" (2005). Materials, Technology and Reliability of Advanced Interconnects-2005. 351.
Retrieved from https://scholarworks.umass.edu/che_faculty_pubs/351
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