Effects of electromigration-induced void dynamics on the evolution of electrical resistance in metallic interconnect lines

Authors

J Cho
MR Gungor
D Maroudas

Publication Date

2005

Journal or Book Title

APPLIED PHYSICS LETTERS

DOI

https://doi.org/10.1063/1.1947373

Pages

-

Volume

86

Issue

24

Recommended Citation

Cho, J; Gungor, MR; and Maroudas, D, "Effects of electromigration-induced void dynamics on the evolution of electrical resistance in metallic interconnect lines" (2005). APPLIED PHYSICS LETTERS. 358.
https://doi.org/10.1063/1.1947373