Electromigration-driven motion of morphologically stable voids in metallic thin films: Universal scaling of migration speed with void size

Authors

JS Cho
MR Gungor
D Maroudas

Publication Date

2004

Journal or Book Title

APPLIED PHYSICS LETTERS

DOI

https://doi.org/10.1063/1.1790037

Pages

2214-2216

Volume

85

Issue

12

Recommended Citation

Cho, JS; Gungor, MR; and Maroudas, D, "Electromigration-driven motion of morphologically stable voids in metallic thin films: Universal scaling of migration speed with void size" (2004). APPLIED PHYSICS LETTERS. 367.
https://doi.org/10.1063/1.1790037