Title
On Temperature Planarization Effect of Copper Dummy Fills in Deep Nanometer Technology
Publication Date
2009
Journal or Book Title
ISQED 2009: PROCEEDINGS 10TH INTERNATIONAL SYMPOSIUM ON QUALITY ELECTRONIC DESIGN, VOLS 1 AND 2
DOI
https://doi.org/10.1109/ISQED.2009.4810344
Pages
494-499
Recommended Citation
Datta, B and Burleson, W, "On Temperature Planarization Effect of Copper Dummy Fills in Deep Nanometer Technology" (2009). ISQED 2009: PROCEEDINGS 10TH INTERNATIONAL SYMPOSIUM ON QUALITY ELECTRONIC DESIGN, VOLS 1 AND 2. 120.
https://doi.org/10.1109/ISQED.2009.4810344
COinS