Title

On Temperature Planarization Effect of Copper Dummy Fills in Deep Nanometer Technology

Publication Date

2009

Journal or Book Title

ISQED 2009: PROCEEDINGS 10TH INTERNATIONAL SYMPOSIUM ON QUALITY ELECTRONIC DESIGN, VOLS 1 AND 2

DOI

10.1109/ISQED.2009.4810344

Pages

494-499

This document is currently not available here.

Share

COinS