On Temperature Planarization Effect of Copper Dummy Fills in Deep Nanometer Technology

Authors

B Datta
W Burleson

Publication Date

2009

Journal or Book Title

ISQED 2009: PROCEEDINGS 10TH INTERNATIONAL SYMPOSIUM ON QUALITY ELECTRONIC DESIGN, VOLS 1 AND 2

DOI

https://doi.org/10.1109/ISQED.2009.4810344

Pages

494-499

Recommended Citation

Datta, B and Burleson, W, "On Temperature Planarization Effect of Copper Dummy Fills in Deep Nanometer Technology" (2009). ISQED 2009: PROCEEDINGS 10TH INTERNATIONAL SYMPOSIUM ON QUALITY ELECTRONIC DESIGN, VOLS 1 AND 2. 120.
https://doi.org/10.1109/ISQED.2009.4810344