A technique for interconnecting millimeter wave integrated circuits using BCB and bump bonds

Authors

R Carrillo-Ramirez
RW Jackson

Publication Date

2003

Journal or Book Title

IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS

DOI

https://doi.org/10.1109/LMWC.2003.811677

Pages

196-198

Volume

13

Issue

6

Recommended Citation

Carrillo-Ramirez, R and Jackson, RW, "A technique for interconnecting millimeter wave integrated circuits using BCB and bump bonds" (2003). IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS. 656.
https://doi.org/10.1109/LMWC.2003.811677