Modeling of interconnections and isolation within a multilayered ball grid array package

Authors

R Ito
RW Jackson
T Hongsmatip

Publication Date

1999

Journal or Book Title

IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES

DOI

https://doi.org/10.1109/22.788517

Pages

1819-1825

Volume

47

Issue

9

Recommended Citation

Ito, R; Jackson, RW; and Hongsmatip, T, "Modeling of interconnections and isolation within a multilayered ball grid array package" (1999). IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES. 665.
https://doi.org/10.1109/22.788517