Publication:
Microstructural modeling for elastic moduli of bonded granules

dc.contributor.authorChang, CS
dc.contributor.authorShi, QS
dc.contributor.authorZhu, H
dc.date2023-09-22T22:43:29.000
dc.date.accessioned2024-04-26T08:50:19Z
dc.date.available2024-04-26T08:50:19Z
dc.date.issued1999
dc.description.pages648-653
dc.identifier.doihttps://doi.org/10.1061/(ASCE)0733-9399(1999)125:6(648)
dc.identifier.urihttps://hdl.handle.net/20.500.14394/4999
dc.relation.ispartofJOURNAL OF ENGINEERING MECHANICS-ASCE
dc.source.issue6
dc.source.issue125
dc.source.statuspublished
dc.titleMicrostructural modeling for elastic moduli of bonded granules
dc.typearticle
dc.typearticle
digcom.contributor.authorChang, CS
digcom.contributor.authorShi, QS
digcom.contributor.authorZhu, H
digcom.identifiercee_faculty_pubs/366
digcom.identifier.contextkey1679646
digcom.identifier.submissionpathcee_faculty_pubs/366
dspace.entity.typePublication
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