Open Access Thesis
Electrical & Computer Engineering
Master of Science in Electrical and Computer Engineering (M.S.E.C.E.)
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With the advent of technology scaling lifetime reliability is an emerging threat in high-performance and deadline-critical systems. High on-chip thermal gradients accelerates localised thermal elevations (hotspots) which increases the aging rate of the semiconductor devices. As a result, reliable operation of the processors has become a challenging task. Therefore, cost effective schemes for estimating temperature and reliability are crucial. In this work we present a reliability estimation scheme that is based on a light-weight temperature estimation technique that monitors hardware events. Unlike previously pro- posed hardware counter-based approaches, our approach involves a linear-temporal-feedback estimator, taking into account the effects of thermal inertia. The proposed approach shows an average absolute error of
We then present a counter-based technique to estimate the thermal accelerated aging factor (TAAF), which is an indicator of lifetime reliability. Results demonstrate that the estimation error is within [−3, +5].
Chhablani, Mayank, "PROCESSOR TEMPERATURE AND RELIABILITY ESTIMATION USING ACTIVITY COUNTERS" (2016). Masters Theses. 318.