A COMPUTER-AIDED-DESIGN TOOL FOR ROBUST MULTICHIP-MODULE PACKAGE DESIGN
Publication Date
1994
Journal or Book Title
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING
Pages
383-394
Volume
17
Issue
3
Recommended Citation
KATRAGADDA, P; BHATTACHARYA, S; and GROSSE, IR, "A COMPUTER-AIDED-DESIGN TOOL FOR ROBUST MULTICHIP-MODULE PACKAGE DESIGN" (1994). IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING. 240.
Retrieved from https://scholarworks.umass.edu/mie_faculty_pubs/240