A COMPUTER-AIDED-DESIGN TOOL FOR ROBUST MULTICHIP-MODULE PACKAGE DESIGN

Authors

P KATRAGADDA
S BHATTACHARYA
IR GROSSE

Publication Date

1994

Journal or Book Title

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING

Pages

383-394

Volume

17

Issue

3

Recommended Citation

KATRAGADDA, P; BHATTACHARYA, S; and GROSSE, IR, "A COMPUTER-AIDED-DESIGN TOOL FOR ROBUST MULTICHIP-MODULE PACKAGE DESIGN" (1994). IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING. 240.
Retrieved from https://scholarworks.umass.edu/mie_faculty_pubs/240