Sacrificial adhesion promotion layers for copper metallization of device structures
Publication Date
2004
Journal or Book Title
LANGMUIR
Pages
9210-9216
Volume
20
Issue
21
Recommended Citation
Zong, YF; Shan, XY; and Watkins, JJ, "Sacrificial adhesion promotion layers for copper metallization of device structures" (2004). LANGMUIR. 1101.
Retrieved from https://scholarworks.umass.edu/pse_faculty_pubs/1101
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