An algorithm for calculating the coupling between MMICs with block dielectric coverings

Wang, ZYJackson, RW2024-04-262024-04-262001-01-01https://doi.org/10.1109/22.899973https://hdl.handle.net/20.500.14394/21366microwave multichip modules, microwave packaging model, MMIC CAD, MMIC coupling, MMIC sealant, module isolation,An algorithm for calculating the coupling between MMICs with block dielectric coveringsarticle