The influence of temperature and concentration on copper deposition kinetics in supercritical carbon dioxide
Publication Date
2004
Journal or Book Title
MATERIALS, TECHNOLOGY AND RELIABILITY FOR ADVANCED INTERCONNECTS AND LOW-K DIELECTRICS-2004
Pages
267-272
Volume
812
Book Series Title
MATERIALS RESEARCH SOCIETY SYMPOSIUM PROCEEDINGS
Recommended Citation
Zong, YF and Watkins, JJ, "The influence of temperature and concentration on copper deposition kinetics in supercritical carbon dioxide" (2004). MATERIALS, TECHNOLOGY AND RELIABILITY FOR ADVANCED INTERCONNECTS AND LOW-K DIELECTRICS-2004. 1100.
Retrieved from https://scholarworks.umass.edu/pse_faculty_pubs/1100
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