Publication:
A Novel Process for Continuous Thermal Embossing of Large-Area Nanopatterns onto Polymer Films

dc.contributor.advisorByung H. Kim
dc.contributor.authorFagan, Matthew D
dc.contributor.departmentUniversity of Massachusetts Amherst
dc.contributor.departmentMechanical Engineering
dc.date2023-09-22T19:38:59.000
dc.date.accessioned2024-04-26T20:48:32Z
dc.date.available2024-04-26T20:48:32Z
dc.date.issued2008-01-01
dc.date.submitted2008-September
dc.description.abstractAs imprint lithography becomes commonplace in industrial manufacturing, the need for fast, reliable modifications to the process are of great importance. In particular, the Roll-to-Roll Nanoimprint Lithography (R2RNIL) method has been proven to yield large areas of continuous, robust patterns in the micro- and nanometer range. A thermal embossing R2RNIL system has been developed that is capable of providing a mold heating rate of 100ÂșC/s with sufficient temperature control to produce large-area patterns continuously at a rate in excess of four feet per minute. This process uses a novel looped-conveyor mold, allowing longer continuous patterns to be produced with superior temperature control than other methods of R2RNIL. Various patterns in the micro- and nanometer domains were replicated using this process.
dc.description.degreeMaster of Science (M.S.)
dc.identifier.doihttps://doi.org/10.7275/607669
dc.identifier.urihttps://hdl.handle.net/20.500.14394/45527
dc.relation.urlhttps://scholarworks.umass.edu/cgi/viewcontent.cgi?article=1259&context=theses&unstamped=1
dc.source.statuspublished
dc.subjectMechanical engineering
dc.subjectemboss
dc.subjectlithography
dc.subjectcontinuous
dc.subjectroll
dc.subjectnano
dc.subjectthermal
dc.subjectMaterials science
dc.titleA Novel Process for Continuous Thermal Embossing of Large-Area Nanopatterns onto Polymer Films
dc.typeopen
dc.typearticle
dc.typethesis
digcom.contributor.authorisAuthorOfPublication|email:mdfagan@student.umass.edu|institution:University of Massachusetts Amherst|Fagan, Matthew D
digcom.identifiertheses/200
digcom.identifier.contextkey607669
digcom.identifier.submissionpaththeses/200
dspace.entity.typePublication
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